Semiconductor module and power converting apparatus using the module

ABSTRACT

A semiconductor module in which a lead electrode is integrally formed with or pressed into resin separated from a resin case, and a connector securing a pad for bonding a metal wire to the lead electrode is bonded to a substrate with a power semiconductor element mounted thereon by an adhesive, and the like in a similar manner as the module case. According to the present invention, an electrode can be disposed in an appropriate position in the semiconductor module, and the scope of the free layout is enhanced.

TECHNICAL FIELD

The present invention relates to a semiconductor module and a powerconverting apparatus using the semiconductor module.

BACKGROUND ART

In recent years, for power semiconductor modules, a current capacity hasbeen wide-ranged from several amperes to several thousands of amperes, asize has been reduced, and a cost has been lowered. In order to achievethe miniaturization, cost reduction and reliability enhancement, inthese power semiconductor modules, a case and an electrode in which apart of the electrode is integrally formed with the resin portion in amodule case (hereinafter referred to as the lead insert case) are used.As one example, a technique is described in Japanese Patent UnexaminedPublication No. 07-263621. However, in the class of several amperes toseveral tens of amperes, since the miniaturization and specialconfiguration of an application itself have been advanced, and thecustomizing of the module has been requested. Examples of requirementsfrom the application include a module outer shape, height, electrodeposition, and the like, particularly the requirements for the electrodeposition differ with the respective applications and the insert caseintegrally provided with the electrode in which a peculiar layout ispossible is required. For this purpose, dies for integrally forming thecase and electrode and extracting the electrode have to be manufacturedfor each requirement, and enormous initial investment and developmentperiod have been necessary.

Moreover, in recent years, a module has also been proposed in which ageneral-purpose connector formed by outserting the electrode to resinssuch as polybutylene terephthalate (PBT) prepared separately from amodule outer case resin is directly fixed, by using a solder, to acopper foil pattern disposed beforehand on an insulating layer in themodule. In this case, the electrode can be disposed without beinginfluenced by a module shape. Additionally, since the general-purposeconnector is utilized, the cost can be reduced, the development periodcan be shortened, and custom requirements can be handled. However, sincethe electrode is fixed by the solder, the soldered part, the insulatinglayer right under the copper foil pattern and the like are destroyed bystresses applied to the solder between the electrode and the copper foilpattern, the copper foil pattern, and the insulating layer right underthe copper foil pattern from the inside or outside of the module,thereby causing reliability deterioration such as insulation defect andwire breaking.

According to the above-described conventional art, the lead insert caseis used to advance the miniaturization and reliability enhancement,while the general-purpose connector is used to lower the cost andshorten the development period.

However, in order to customize the power semiconductor module, when thelead, insert case is used, the scope of the free design is lowered, andthe enormous initial investment and long development period arenecessary. Moreover, when the general-purpose connector is used, therearises a problem that the reliability is deteriorated.

DISCLOSURE OF THE INVENTION

An object of the present invention is to provide a semiconductor modulewhich avoids the deterioration of the scope of the free design of acustom module for various applications, reduces a size, lowers a cost,enhances a reliability and shortens a development period.

To solve the above-described problem, according to the presentinvention, there is provided a semiconductor module in which a leadelectrode is covered with a resin member separated from a case, and aconnector securing a space for bonding a metal wire to the electrodepart is bonded to a substrate with a emiconductor element mountedthereon.

With such a connector, the electrode can be disposed in an appropriateposition in the power semiconductor module without being largelyinfluenced by a module case shape and the scope of free layout isimproved, while the custom module can be provided without developing alead insert case for each requirement from each application, whichenables the cost reduction, reliability enhancement, initial investmentreduction, and shortened development period.

Moreover, since the electric connection between the connector and awiring pattern to connect the semiconductor element mounted on thesemiconductor module to other circuit components is performed not bysoldering, but by the bonding of the metal wire, the reliability againstthe wire breaking, insulation, and the like can be improved.

When the semiconductor module according to the present invention isapplied to power converting apparatuses such as an inverter, the scopeof the free arrangement of the semiconductor module and the substratewith other electric circuit components is increased. Therefore, thepower converting apparatus can be miniaturized.

According to the present invention, there is provided anothersemiconductor module comprising: a resin case; a semiconductor elementdisposed in the resin case; a lead electrode electrically connected tothe semiconductor element and extracted to the outside of the resincase; and a substrate with electric circuit components mounted thereon.Further, the substrate is positioned over the semiconductor element, andremovably connected to the lead electrode. As a concrete constitution ofthe above semiconductor module, there is a structure that the substratewith the electric circuit components mounted thereon is removablyconnected to the lead electrode in the above described semiconductormodule according to the present invention.

According to the present invention, there is provided another powerconverting apparatus comprising: a resin case, a semiconductor moduleprovided with the resin case, a semiconductor element disposed in theresin case, and a lead electrode electrically connected to thesemiconductor element and drawn to the outside of the resin case; and asubstrate with electric circuit components mounted thereon. Further, thesubstrate is positioned above the semiconductor module, and removablyconnected to the lead electrode. As a concrete constitution of anotherpower converting apparatus according to the present invention, theabove-described concrete constitution of another semiconductor module ofthe present invention is applied.

With another semiconductor module and power converting apparatusaccording to the present invention, various types and series of thesemiconductor modules and the power converting apparatuses can easily beobtained. Therefore, the costs of the semiconductor module and the powerconverting apparatus can be lowered.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top view showing a first embodiment.

FIG. 2 is a sectional view taken along A-A′ in FIG. 1.

FIG. 3 is a top view showing a second embodiment.

FIG. 4 is a sectional view taken along B-B′ in FIG. 3.

FIG. 5 is a top view showing a third embodiment.

FIG. 6 is a sectional view taken along C-C′ in FIG. 5.

FIG. 7 is a top view showing a fourth embodiment.

FIG. 8 is a sectional view taken along D-D′ in FIG. 7.

FIG. 9 is a top view showing a fifth embodiment.

FIG. 10 is a sectional view taken along E-E′ in FIG. 9.

FIG. 11 is a top view showing a sixth embodiment.

FIG. 12 is a sectional view taken along F-F′ in FIG. 11.

FIG. 13 is a sectional view showing a seventh embodiment.

FIG. 14 is a sectional side view in FIG. 13.

FIG. 15 is a sectional view showing an eighth embodiment.

FIG. 16 is a top view in FIG. 15.

FIG. 17 is a sectional view of a power converting apparatus which usesthe eighth embodiment.

FIG. 18 is a sectional view showing a ninth embodiment.

FIG. 19 is a sectional side view in FIG. 18.

FIG. 20 is a sectional view showing a tenth embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION

One embodiment according to:the present invention will be describedhereinafter with reference to the drawings.

FIG. 1 is a top view showing a first embodiment of a power semiconductormodule according to the present invention, and FIG. 2 is a sectionalview taken along A-A′ line in FIG. 1.

In the power semiconductor module of FIG. 1, a plurality of transistors1 and diodes 2 are attached to a plurality of insulating ceramic plates4 of AlN or the like. The insulating ceramic plates 4 are arranged inthe predetermined positions on a metal substrate 3. A method of mountingthe metal substrate 3 and semiconductor elements disposed on thesubstrate is similar to that of a conventional power semiconductormodule. Specifically, on the metal substrate 3, the plurality of theinsulating ceramic plates 4 of AlN or the like are fixed to the metalsubstrate 3 by solder. Fixed on the insulating ceramic plate 4 is a foilconductor pattern 5 for connecting the main electrodes and controlelectrodes of the transistor 1 and diode 2. The transistor 1 and diode 2are fixed onto the foil conductor pattern 5 by the solder. The electrodeof each semiconductor element and the foil conductor pattern 5 areconnected to an electrode 8 fixed to a resin case 7 by wire bonding of ametal wire 6. The electrode 8 is a lead electrode to electricallyconnect a module internal circuit to a modules external part.

The present embodiment is characterized in that as shown in FIGS. 1 and2, a connector obtained by integrally forming the electrode 8 and aresin member 9 separated from the resin case 7 or pressing the formerinto the latter is disposed as a component. The surface opposite to thecontact surface of the connector and the metal substrate 3 is provided,by using a part of the electrode 8, with a pad 10 to which the metalwire 6 can be bonding-connected. The resin member 7 of the connector isbonded to the metal substrate 3 by a silicon resin-based adhesivematerial 11. The foil conductor pattern 5 and semiconductor element onthe insulating ceramic plate 4 is electrically connected to the pad 10by the wire bonding with the metal wire 6.

Specifically, in the present embodiment, mechanical fixing means(adhesive material) in the electrode 8 is different from electricconnecting means (wire) therein.

Since the above-described connector is used, a conventional process ofsoldering the electrode 8 and the foil conductor pattern 5 can beomitted, thereby avoiding the reliability deterioration such as thedestruction of the soldered surface and insulating layer by the stressgenerated in the soldered part. Moreover, since the connector is fixedby the adhesive material, and the electrode 8 is not directlyincorporated in the resin case 7, the connector position can easily bechanged without changing the resin case 7. Therefore, the layout changeof the electrode 8 is facilitated. Moreover, the adaptation of themodule outer configuration to clients does not require the change of theelectrode 8 with the change of the resin case 7. Specifically, since themodule components other than the outer case can be constituted incommon, the cost reduction, and short period for delivery can beachieved. Moreover, since the electric connection in the electrode 8 isperformed by the wire bonding without using the conductive bondingmaterials such as the solder, the soldering layer of the electrodesoldered part, the foil conductor pattern, and the insulating ceramicplate are prevented from being destroyed by the stresses applied to theelectrode 8 from the inside or outside of the module. Therefore, thereliability of the power semiconductor module is enhanced.

Preferably, rigid resins such as polyphenylene sulfide (PPS) are used inthe resin member 9 of the connector to secure a strength. Moreover, thethickness of the resin part right under the pad 10 is of the order of 1mm to 20 mm to enhance the bonding reliability. Copper is used as thematerial of the electrode 8, and the copper surface of the pad 10 isplated with metal which hardly rusts, so that the reliability is furtherenhanced.

FIG. 3 is a top view showing a second embodiment of the powersemiconductor module according to the present invention, and FIG. 4 is asectional view taken along a B-B′ line in FIG. 3.

The embodiment in FIGS. 3 and 4 is different from the above-describedembodiment in FIG. 1 in that the part of the lead electrode 8 coveredwith the resin member 9 is bent upward with respect to the surface ofthe pad 10, and the connector is directed to the top surface of themodule. Here, the external connecting part in which the lead electrode 8is exposed is extracted from the top surface of the resin case 7. Thiscan increase the scope of the free connecting method to the externalcircuit and can miniaturize the application. Moreover, a plurality oftypes of connectors different in the shape and number of the electrode 8and the shape of the pad 10 can be used like in the present embodiment.

According to the present embodiment, the layout can be realized in aminimum mounting area by considering an insulation distance necessarybetween the electrodes 8. Specifically, while the user's requirementwith respect to the position of the electrode 8 is sufficientlyreflected, the small-size low-cost module can be provided in a shortperiod for delivery and the reliability can be enhanced.

FIG. 5 is a top view showing a third embodiment of the powersemiconductor module according to the present invention, and FIG. 6 is asectional view taken along a C-C′ line in FIG. 5.

The embodiment in FIGS. 5 and 6 is different from the above-describedembodiment in FIGS. 1 and 3 in that the electrodes 8 in the connectorare bent upward with respect to the surface of the pads 10, and the padsare disposed on both sides of the bent part of the electrodes 8.Thereby, bonding can be performed to the pad 10 from both sides of theconnector, and the scope of the free layout of the foil conductorpattern 5 in the module and of the circuit constituting element canstrikingly be enhanced. Therefore, the miniaturization and costreduction of the power semiconductor module are facilitated.

Furthermore, according to the present embodiment, since the scope offree setting of the connector position is large, during the connectingof a plurality of semiconductor elements, particularly the switchingelements such as the transistor 1 in parallel, a wiring inductance isbalanced in each element, and the switching operation can be uniformed.

FIG. 7 is a top view showing a fourth embodiment of the powersemiconductor module according to the present invention, and FIG. 8 is asectional view taken along a D-D′ line in FIG. 7.

The embodiment in FIGS. 7 and 8 is different from the above-describedembodiment in FIGS. 3 and 4 in that a jig 13 for determining theposition to fix the connector onto the metal substrates 3 is soldered orfixed otherwise to a jig foil conductor pattern 12 disposed beforehandon the top surface of the metal substrate 3, and a hole 16 for the jig13 is formed in a predetermined position on the bottom surface of theconnector resin member 9. This can enhance the positioning precision ofthe connector when the module is assembled. Moreover, the thickness ofthe adhesive 11 for fixing the connector can precisely be set byadjusting the height of the jig 13 and the depth of the hole 16.Therefore, the yield can be improved, and the cost reduction andreliability enhancement are facilitated.

FIG. 9 is a top view showing a fifth embodiment of the powersemiconductor module according to the present invention, and FIG. 10 isa sectional view taken along a E-E′ line in FIG. 9.

The embodiment in FIGS. 9 and 10 is different from the above-describedembodiment in FIGS. 7 and 8 in that the jig for determining the positionto fix the connector onto the metal substrate 3 is incorporatedbeforehand in the resin case 7 itself. Specifically, a plurality ofprotrusions 14 are disposed on predetermined positions of the inner sidesurface of the resin case 7, while on the connector side a plurality ofgrooves 15 for accommodating the protrusions 14 of the case are disposedon the predetermined positions of the contact surface of the resinmember 9 and resin case 7 in the connector. This can enhance thepositioning precision of the connector when the module is assembled.Furthermore, since a plurality of protrusions 14 and grooves 15 areprepared, the position of the connector can easily be moved in parallel,the scope of free layout is enhanced, the period for delivery can beshortened, and the yield improvement and dies-less process can berealized. Therefore, the power semiconductor module is presented withlow cost and high reliability.

FIG. 11 is a top view showing a sixth embodiment of the powersemiconductor module according to the present invention, and FIG. 12 isa sectional view taken along a F-F′ line in FIG. 11.

The embodiment in FIGS. 11 and 12 is different from the above-describedembodiment in FIGS. 9 and 10 in that as the jig, incorporated beforehandin the resin case 7 itself, for determining the position to fix theconnector, a tray part 17 for accommodating the connector is disposed onthe entire inner periphery of the resin case 7. This can enhance thepositioning precision of the connector when the module is assembled, theconnector position can easily be moved in parallel, the scope of thefree layout is enhanced, and the period for delivery can be shortened.

FIG. 13 is a sectional view showing a power converting apparatusaccording to a seventh embodiment of the present invention, and FIG. 14is a sectional side view.

In the power converting apparatus of the present embodiment, the powersemiconductor module according to the present invention is disposed onthe bottom part of a case 24. As shown in the above-described second tosixth embodiments, the present power semiconductor module is providedwith a plurality of connectors in which the electrode 8 bent upward withrespect to the surface of the pad 10 is covered with the resin member 9separated from the resin case 7, and the connector resin member 9 isbonded to the metal substrate 3. Furthermore, incorporated in thepresent power semiconductor module is a printed wiring board 14 on whicha microprocessor unit 17 for controlling the output properties ofrotating machines such as an induction electric motor, a peripheralcircuit thereof, a drive circuit 18 for driving the transistor 1 as apower semiconductor element, a controlling power circuit, and atransformer 20 are mounted. The printed wiring board 14 is positionedabove a power circuit part provided with the transistor 1 and diode 2,and is electrically connected to the power circuit part via theconnector electrode 8. Additionally, the power circuit part constitutesan inverter circuit for driving the rotating machine. The powersemiconductor module is filled with a resin 25. The resin 25 covers andprotects the power circuit part and printed wiring board 14. Positionedon the power semiconductor module is a printed wiring board 15 on whichan electrolytic capacitor 19 for accumulating power to be supplied tothe rotating machine and a terminal base 21 for connecting an outputwiring to the rotating machine are mounted. The printed wiring board 15is electrically connected to the power circuit part via the connectorelectrode 8. Furthermore, attached to the upper inner part of the case24 is a user interface printed wiring board 16 on which themicroprocessor unit 17 connected to a host control apparatus, varioussensor circuits and user interface circuits, a volume resistance 22 foradjusting the output properties of the rotating machine, a display 23for informing an operator of the operation state and the like of thepower converting apparatus, and the like are mounted.

The present embodiment is characterized in that the printed wiringboards 14 and 15 are electrically connected to the power circuit part ofthe power semiconductor module via the connector as shown in the secondto sixth embodiments. Particularly by using the solder in the electricconnection of the connector and printed wiring board 14, an electricconnection defect by the resin 25 for use in sealing the semiconductormodule can be eliminated. Moreover, the height dimension of theconnector for connecting the printed wiring board 15 to the powersemiconductor module is larger than that of the connector for connectingthe printed wiring board 15 to the power circuit part. Therefore, theprinted wiring board 15 can be overlapped and disposed above the powersemiconductor module. Therefore, the power converter can beminiaturized. Moreover, since the printed wiring board 15 can beoverlapped and disposed on the power semiconductor module, a space fordisposing other printed wiring boards such as the printed wiring board16 of the present embodiment or other electric components is secured inthe inner side surface and the upper part of the case 24. Therefore,even when a plurality of printed wiring boards and electric componentsother than the power semiconductor module are necessary, the powerconverting apparatus can be miniaturized.

By using the above-described connector, the conventional process ofsoldering the electrode 8 and the foil conductor pattern 5 can beomitted, and the reliability deterioration, such as destruction of thesoldered surface and the insulating layer by the stress generated in thesoldered part from the outside of the semiconductor module, isprevented. Moreover, since the electrode 8 is not directly incorporatedin the resin case 7 for the module, the layout of the electrode 8 caneasily be changed by freely selecting the position and the shape of theconnector 9 and moving and changing the connector 9. Therefore, thescope of the free layout of the power semiconductor module electrode 8can strikingly be enhanced, and the scope of the free layout of thecomponents of the power converting apparatus using the powersemiconductor module is strikingly enhanced, thereby, theminiaturization and customization are facilitated. Moreover, the stressto the electrode 8 generated by the expansion/contraction of the resin25 covering the printed wiring board 14 incorporated in the powersemiconductor module fails to destroy the insulating layer 4 and thefoil conductor pattern on the insulating layer 4 because the electrode 8is not fixed to the module internal circuit by the solder. Therefore,the power semiconductor module and power converting apparatus can berealized in which the deterioration of the dielectric strength hardlyoccurs, the reliability is high, and the customization is facilitated.

FIGS. 15, 16, and 17 show an eighth embodiment of the present invention,and are a sectional view showing the electrode part of the powersemiconductor module, a top view, and a sectional view of the powerconverting apparatus using the present power semiconductor module,respectively.

The present embodiment is different from the above-described embodimentsin that the connector resin member 9 is provided with a plug typeterminal base 26 and the printed wiring boards 14, 15 are provided witha connection terminal 27 so that the printed wiring boards 14, 15 aredetachably attached and extractably inserted. The connection terminal 27is detachably attached or extractably inserted and electricallyconnected to the connector electrode 8. The plug type terminal base 26is constituted of a recess which is disposed in the connection part ofthe connection terminal 27 and electrode 8 in the part of the resinmember 9 covering the upward directed part of the electrode 8. Theconnection part with the connection terminal 27 in the electrode 8 ispositioned in the recess. Therefore, since the connection terminal 27 isinserted into the recess, the position of the terminal is fixed and theterminal is electrically connected to the electrode 8. Therefore, acurrent is stably passed between the connection terminal 27 and theelectrode 8. Moreover, since the power circuit part on the metalsubstrate 3 and the printed wiring board 14, and the power semiconductormodule and the printed wiring board 15 can be interconnected withoutusing the solder, the reliability deterioration caused by the stress inthe connected part can be prevented, and a highly reliable semiconductormodule and power converting apparatus can be constituted. Moreover, whenthe printed wiring board 14 is installed in the semiconductor modulecase 7, the resin 25 is injected to a position lower than the plug typeterminal base 26, in order to prevent the resin 25 from entering theplug type terminal base 26 disposed on the connector resin member 9.Thereby, since the printed wiring boards 14, 15 can easily be detached,during the occurrence of the defect, the replacement of the printedwiring boards is facilitated, and the yield is enhanced. Therefore, thecost reduction of the power semiconductor module and power convertingapparatus using the power semiconductor module can be realized.

FIG. 18 is a sectional view showing the power converting apparatus usingthe power semiconductor module according to the ninth embodiment of thepresent invention, and FIG. 19 is a sectional side view.

The present embodiment is different from the above-described embodimentsfirst in that by molding resin, the resin case 7 of the powersemiconductor module is integrally formed with the metal substrate 3with the connector 9 and the power semiconductor element constitutingthe power circuit part mounted beforehand thereon. The connector resinmember 9 includes the plug type terminal base 26 similar to that of theeighth embodiment. Furthermore, the connector resin member 9 in thepresent embodiment includes a horizontal part which extends to theoutside of the top surface of the metal substrate in a horizontaldirection parallel with the top surface of the metal substrate 3, andthe plug type terminal base 26 similar to that of the eighth embodimentis disposed on a vertical part which extends in a direction vertical tothe horizontal part and is positioned outside the molded resin case 7.The vertical part of the resin member 9 extends to the lower surface ofthe metal substrate 3 under the horizontal part. For the connector, thelower surface of the end of the horizontal part of the resin member 9 inthe case 7 is bonded to the top surface of the metal substrate 3 by theadhesive. Moreover, the surface of the wire bonding pad 10 provided onthe electrode 8 is exposed in the horizontal part of the resin member.The lead electrode is passed through the horizontal part and verticalpart of the resin member 9, and extracted to the outside from the insideof the case 7. In the present embodiment, since the connector isconfigured as described above, and the horizontal part of the connectorresin member 9 is held by the mold dies, the connector can easily beheld in the mold dies, and the leakage of the resin from the mold diescan be prevented during the resin molding. Moreover, the position of thelead electrode of the power semiconductor module can be changed bychanging the connector without changing the mold dies. Therefore, sincethe scope of the free layout of the lead electrode increases, the powersemiconductor module and the power converting apparatus can be realizedwith low cost so that the customization is facilitated.

The eighth embodiment in FIGS. 18 and 19 is different from theabove-described embodiments secondly in that since the connector isfixed to the case 7 by the molding resin, the process of bonding theconnector to the metal substrate 3 can be simplified. In the bondingprocess, a small amount of adhesive 11 is applied to only a part of theconnection surface of the connector and the metal substrate 3.Specifically, in the bonding process, the connector is tentativelybonded to the metal substrate 3 by the adhesive to such an extent thatthe positional relation of both does not deviate in the molding process,and a large bond strength is unnecessary. Therefore, since the adhesiveapplying process can be shortened and the use amount can be reduced, thelow-cost semiconductor module and the power converting apparatus can berealized.

The eighth embodiment of FIGS. 18 and 19 is different from theabove-described embodiments thirdly in that the printed wiring board 14is covered with the resin 25 and the connection terminal 27 is protrudedto the outside of the resin 25. Specifically, the printed wiring board14 forms one module separate from the power circuit part, that is, acontrol circuit module. Similarly to the embodiment of FIG. 17, theconnection terminal 27 is inserted to the plug type terminal base 26,fixed in the position and electrically connected to the lead electrode.Therefore, by using the power semiconductor module incorporating thepower circuit part in common, and preparing a large number of controlcircuit module specifications in,which the detachable/attachable printedwiring board 14 is covered with the resin 25, various types and seriesof the power converting apparatuses are easily obtained, and the costreduction of the power converting apparatus is achieved.

FIG. 20 is a sectional :view showing the power converting apparatusaccording to a tenth embodiment of the present invention.

The present embodiment is different from the embodiment of FIG. 18 inthat the printed wiring board 14 with the microprocessor unit 17 and thedrive circuit 18 for driving the power,semiconductor element mountedthereon is molded together with the power circuit part by the resin case7. Furthermore, in the present embodiment, the connector is bonded tothe printed wiring board 14 by the adhesive 11. The power circuit parton the metal substrate 3 is electrically connected to the circuit on theprinted wiring board 14 by wire bonding. Since the microprocessor unit17 and the drive circuit 18 for driving the power semiconductor elementare molded by the resin case 7, not only the coated package product butalso bare chips can be mounted. According to the present embodiment,since the covering of the printed wiring board 14 with resin isunnecessary, the cost reduction of the power converting apparatus andthe power semiconductor module can be realized. Moreover, by using thebare chips, the coating and packaging of the microprocessor unit 17,drive circuit 18, and the like individually with resin are unnecessary,which enables the miniaturization and cost reduction of the printedwiring board 14. Therefore, the miniaturization and cost reduction ofthe power converting apparatus and power semiconductor module can berealized.

In the power semiconductor modules and power converting apparatuses ofthe above described embodiments, various power semiconductor elementssuch as an insulating gate type bipolar transistor, a MOSFET, and abipolar transistor can be used.

As described above, according to the present invention, the electrodelayout can be performed without being influenced by the outerconfiguration of the power semiconductor module, the scope of the freeconstruction and package of the circuit inside and outside the powersemiconductor module is enhanced, and the miniaturization, costreduction and reliability enhancement of the semiconductor module andthe power converting apparatus using the semiconductor module can beachieved.

What is claimed is:
 1. A semiconductor module with a semiconductorelement mounted thereon, comprising: a connector in which a leadelectrode is covered with a resin member separated from a semiconductormodule case, and said lead electrode is provided with a wiring bondingpad bonding-connectable to a metal wire to connect said lead electrodeto said semiconductor element, said resin member of the connector beingbonded to the module.
 2. The semiconductor module according to claim 1wherein in said lead electrode, said pad is provided on a surfaceopposite to a contact surface of the lead electrode and said resinmember.
 3. The semiconductor module according to claim 1 wherein saidlead electrode is bent with respect to said pad surface.
 4. Thesemiconductor module according to claim 2 wherein the thickness of saidresin member between said contact surface and the bonded part of saidresin member in said module is in a range of 1 mm to 20 mm.
 5. Thesemiconductor module according to claim 1 comprising: means forpositioning said connector in the module.
 6. The semiconductor moduleaccording to claim 1 wherein said connector is a connector forconnecting a substrate on which an electric circuit component ismounted.
 7. The semiconductor module according to claim 1 furthercomprising: a substrate with an electric circuit component mountedthereon, said substrate being positioned over said semiconductorelement, sand substrate being connected to said connector.
 8. Thesemiconductor module according to claim 7 wherein said substrate isdisconnectably connected to said connector.
 9. The semiconductor moduleaccording to claim 1 comprising: a plurality of said connectors, theplurality of said connectors including a first connector, and a secondconnector higher than the first connector; and a substrate with anelectric circuit component mounted thereon, said substrate beingpositioned over said semiconductor element, said substrate beingconnected to said first connector.
 10. The semiconductor moduleaccording to claim 9 wherein said substrate is disconnectably connectedto said first connector.
 11. A power converting apparatus comprising:the semiconductor module according to claim 1; and a substrate with anelectric circuit component mounted thereon, said substrate beingpositioned above said semiconductor module, said substrate beingconnected to said connector.
 12. A power converting apparatuscomprising: the semiconductor module according to claim 9; and anothersubstrate with an electric circuit component mounted thereon, saidanother substrate being positioned above said semiconductor module, saidanother substrate being connected to said second connector.
 13. Thepower converting apparatus according to claim 12 wherein said anothersubstrate is disconnectably connected to said second connector.
 14. Asemiconductor module according to claim 1 wherein said semiconductormodule case is comprised of resin.